Materials & membranes
Silver nanoparticle inks for printed circuits, with applications in RFID, solar cells, semiconductors and OLED displays.
Features
Electrical conductivity.
Uniform particle-size distribution, inkjet printability and storage stability.
For RFID, solar cells, semiconductors and OLED-display research.
Custom formulation development available.
Specifications
|
Parameter |
Test method |
Property |
||
|
Model |
N/A |
TL-Ink10 |
TL-Ink100 |
TL-Ink50 |
|
Vehicle |
N/A |
Oil-based |
Water- or solvent-based |
Water- or solvent-based |
|
Silver particle size |
N/A |
10nm |
100nm |
50nm |
|
Appearance |
Visual inspection |
Blue-black dispersion |
Golden-yellow dispersion |
Blue-black dispersion |
|
Viscosity |
Rotational viscometer, 80/50 rpm at 25oC) |
5～1000cP |
8～1000cP |
5-500cp |
|
Sheet resistance |
Four-point probe |
10～120 mΩ/□/mil |
10～80 mΩ/□/mil |
10～60 mΩ/□/mil |
|
Adhesion |
Cross-cut test / 3M 600 tape |
≥4B |
≥4B |
≥4B |
|
Application methods |
N/A |
Spray, spin, roll coating and industrial printheads |
Spray, spin, roll coating and industrial printheads |
Spray, spin, roll coating and industrial printheads |
Processing conditions
Substrates: PET, Teslin, coated paper, photo paper, silicon and other plastics.
TL-Ink10: thermal curing at 150°C for 1 hour.
TL-Ink100: thermal curing at 150°C for 1 hour.
TL-Ink50: thermal curing at 130°C for 3 minutes.
The source describes pulsed-laser or UV processing on microsecond timescales. Confirm equipment, energy and substrate compatibility before selecting these conditions.
The source describes water/solvent formulations without benzene. Request the safety data sheet for the selected grade before handling.
Storage and use
- Vacuum-packed. For long-term storage, keep sealed and protected from light at 0–15oC. Use within one week after opening.
- Mix thoroughly before use. Recommended mechanical mixing: 5–10 minutes at 500 rpm.
Related systems
Tell us what you want to make.
Share your material, target structure and sample size. We can discuss a suitable platform and configuration.